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A three-dimensional integrated circuit (3D IC) is a MOS (metal-oxide semiconductor) integrated circuit (IC) manufactured by stacking as many as 16 or more ICs and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, [1][2] so that they behave as a single device to achieve performance ...
This is a list of semiconductor fabrication plants.A semiconductor fabrication plant is where integrated circuits (ICs), also known as microchips, are manufactured.They are either operated by Integrated Device Manufacturers (IDMs) that design and manufacture ICs in-house and may also manufacture designs from design-only (fabless firms), or by pure play foundries that manufacture designs from ...
3D printing or additive manufacturing is the construction of a three-dimensional object from a CAD model or a digital 3D model. [1] [2] [3] It can be done in a variety of processes in which material is deposited, joined or solidified under computer control, [4] with the material being added together (such as plastics, liquids or powder grains being fused), typically layer by layer.
Rapid prototyping. A rapid prototyping machine using selective laser sintering (SLS) 3D model slicing. Rapid prototyping is a group of techniques used to quickly fabricate a scale model of a physical part or assembly using three-dimensional computer aided design (CAD) data. [1][2] Construction of the part or assembly is usually done using 3D ...
FreeStyle Libre. The FreeStyle Libre received FDA approval in 2017 for use in adults with diabetes. It does not require finger-prick blood samples. Instead, this meter reads glucose from ...
Plastic leaded chip carrier (PLCC): square, J-lead, pin spacing 1.27 mm. Quad flat package (QFP): various sizes, with pins on all four sides. Low-profile quad flat-package (LQFP): 1.4 mm high, varying sized and pins on all four sides. Plastic quad flat-pack (PQFP), a square with pins on all four sides, 44 or more pins.
TSMC Global R＆D Center at night. Taiwan Semiconductor Manufacturing Company Limited (TSMC or Taiwan Semiconductor) [4][5] is a Taiwanese multinational semiconductor contract manufacturing and design company. It is the world's second-most valuable semiconductor company, [6] the world's largest dedicated independent ("pure-play") semiconductor ...
3 nm process. In semiconductor manufacturing, the 3nm process is the next die shrink after the 5 nm MOSFET (metal–oxide–semiconductor field-effect transistor) technology node. South Korean chipmaker Samsung started shipping its 3 nm gate all around (GAA) process, named 3GAA, in mid-2022. [1][2] On 29 December 2022, Taiwanese chip ...