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Camp Marmal was an installation of the Afghan Armed Forces. It was adjacent to Maulana Jalaluddin Balkhi International Airport in Mazar-i-Sharif, Afghanistan, at the foot of the Hindu Kush mountains. The camp was opened in September 2005. The camp gets its name from the bordering Marmal Mountains. Prior to the withdrawal of German troops, it ...
The average American received about 70% more packages in 2022 than in 2017, according to a Capital One shopping research report. And a recent survey of 300 retail executives by the location data ...
TO-92: Plastic-encapsulated package with three leads. TO-99: Metal can package with eight radial leads. TO-100. TO-126: Plastic-encapsulated package with three leads and a hole for mounting on a heat sink. TO-220: Through-hole plastic package with a (usually) metal heat sink tab and three leads.
BSk. Mazar-i-Sharīf ( / məˈzæri ʃəˈriːf / mə-ZARR-ee shə-REEF; Dari and Pashto: مزار شریف ), also known as Mazar-e Sharīf or simply Mazar, is the fourth-largest city in Afghanistan by population, with an estimated 500,207 residents in 2021. [1] It is the capital of Balkh province and is linked by highways with Kunduz in the ...
Orobus lens (L.) Stokes (1812) The lentil ( Vicia lens or Lens culinaris) is an edible legume. It is an annual plant known for its lens -shaped seeds. It is about 40 cm (16 in) tall, and the seeds grow in pods, usually with two seeds in each. Lentils are used around the world for culinary purposes.
Dantrolene. Dantrolene (Dantrium) is a skeletal muscle relaxer used to treat muscle spasms caused by spinal cord injury, stroke, cerebral palsy, or MS. It works by acting directly on the skeletal ...
Marsa Alam International Airport. / 25.55694°N 34.58361°E / 25.55694; 34.58361. Marsa Alam International Airport ( IATA: RMF, ICAO: HEMA) is an international airport located 60 km north of Marsa Alam in Egypt. It is an important destination for leisure flights from Europe.
SOIC-16. A PIC microcontroller (wide SOIC-28) in a ZIF socket. A small outline integrated circuit ( SOIC) is a surface-mounted integrated circuit (IC) package which occupies an area about 30–50% less than an equivalent dual in-line package (DIP), with a typical thickness being 70% less. They are generally available in the same pin-outs as ...