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The global market for Electronics Manufacturing Services (EMS) reached an estimated value of US$504.2 billion in 2023 and is projected to grow at a CAGR of 4.94% during the forecast period 2024-2030, reaching a revised size of US$707.5 billion by 2030. [5] The EMS industry is commonly divided into Tiers by their revenue: [6] Tier 1: >$5 Billion.
Surface-mount technology (SMT) component placement systems, commonly called pick-and-place machines or P&Ps, are robotic machines which are used to place surface-mount devices (SMDs) onto a printed circuit board (PCB). They are used for high speed, high precision placing of a broad range of electronic components (such as capacitors, resistors ...
Hon Hai Precision Industry Co. Ltd., trading as Hon Hai Technology Group in China and Taiwan, and known as Foxconn Technology Group internationally, is a Taiwanese multinational electronics contract manufacturer established in 1974 with headquarters in Tucheng District, New Taipei City, Taiwan. In 2023, the company's annual revenue reached 6.16 ...
In electronics, rework (or re-work) is the repair or refinish of a printed circuit board (PCB) assembly, usually involving desoldering and re- soldering of surface-mounted electronic components (SMD). Mass processing techniques are not applicable to single device repair or replacement, and specialized manual techniques by expert personnel using ...
IPC is a trade association whose aim is to standardize the assembly and production requirements of electronic equipment and assemblies. IPC is headquartered in Bannockburn, Illinois, United States with additional offices in Washington, D.C. Atlanta, Ga., and Miami, Fla. in the United States, and overseas offices in China, Japan, Thailand, India ...
Wire bonding. The interconnections in a power package are made using thick (250 to 400 μm), wedge-bonded, aluminium wires. Inside a wire-bonded BGA package. This package has an Nvidia GeForce 256 GPU. Wire bonding is a method of making interconnections between an integrated circuit (IC) or other semiconductor device and its packaging during ...